ISO 9001:2008 Registered Firm; ANSI/ASQ Q9001:2008 Compliant
Workmanship to IPC-A-610 - Class II & Class III
PCBA, Cable and Mechanical Assembly; Programming, Test & Debug: Box Build & Calibration
Concept, Prototype, NPI, & “On-Shore” Product Configurations
Consignment, Bulk Consignment, Partial Turn Key, and Full Turn Key Manufacturing Models
Logistics and Materials Management - Purchasing, Cost Reduction, Distribution Fulfillment
Surface Mount Assembly
o Leaded & Lead-Free Alloys (Sn63/Pb37 and SAC 305 Standard) in both No-Clean & Water Soluble Flux Packages
o Single/double sided solder paste and/or epoxy process – single or combined process
o Intrusive as well as standard SMT Processes
o Thermal curing and conditioning process profiles
o Maximum Placements per hour ~ 171,000
o Maximum PCB Size – 21.5” X 23.5”
o Component Size - 0201 & up
o POP (Package-on-Package Process); Pre-stacked POP down at 0.4m
o BGAs to 0.4mm(16mil) pitch production ; CSPs 0.25mm(10 mils) pitch proto
o Material Handling -Bulk, Strip, Reel, Stick, Trays and Gel/Waffle packs
Thru Hole Assembly, Touch Up and Second Operations
o Water-Soluble and No-Clean soldering fluxes
o Sn63/Pb37 Wave Soldering - Maximum PCB width ~ 15.5”
o SAC 305 and Sn63/Pb37 Selective and Hand Soldering
o Standard and “on-BGA” rework
BGA Rework and Processing
o Moisture Conditioning Bake and Vacuum Sealing
o Leaded and Lead-free BGA Removal, Site Prep and/or Replacement
o Leaded and Lead-free BGA Re-balling
o Leaded and Lead-free BGA Repair and Package Modification (subject to requirements)
o POP Removal / Replacement / Reball - Developing Process for Top Part Replacement Only
Inspection and Test
o AOI and Microscope Inspection
o Flying Head Probe
o Test and Calibration labor for Customer Supplied Test Systems
o Test Modifications and Improvements for Customer Supplied Test System
o PCA Tester Design and Test Methodology development
Engineering Process Support
o DFM Analysis and component/assembly defect/failure RCA
o Lead-Free, Sn63/Pb37 and other alloy Soldering Process Development
o Assembly Process Development - Design, Mechanical Assembly and Cleaning Methods
o X-Ray (Planar 5 micron resolution) for BGA Inspection & PCB/PCA Defect Analysis
o Power–on, Hot-Cold Temp Cycling Environmental Chamber
PCBA Design and Layout
o Custom footprint, pad stack and library creation
o Full PCB layout from concept to fabrication
o Auto-routing and manual routing
o ECO layout and incorporation
